Remtec to Attend PACK EXPO International 2022

Remtec is excited to announce that we will be attending PACK EXPO International, taking place at McCormick Place in Chicago, IL, October 23rd -26th, 2022. Featuring packaging and processing solutions as well as educational sessions and networking opportunities, PACK EXPO International will be the industry’s most comprehensive event. This global show features the industry’s largest showcase of technology, including many product launches for more than 40 vertical industry sectors.

At PACK EXPO, Remtec will be promoting our robotic palletizing, depalletizing, case packing and high speed picking systems. Robotic automated packaging has increased productivity in a wide range of packaging related industries including food processing, manufacturing, and consumer goods. Custom engineered robotic systems offer flexibility in a variety of packaging operations.

Robot technology offers significant benefits in rapid handling packaging industry applications such as case packing, tray packing, and kitting. It is common to achieve robotic cycle rates above 100 picks per minute. Innovative integrated vision capability has reduced both product changeover time and system costs. Multi-robot systems substantially increase throughput rates.

The video below shows robotic loading of small tubes and unloading blister backs from a Sonoco Alloyd rotary blister seal machine. Fanuc SR-6iA scara robots are using vision based line tracking to randomly pick and load various blister pack configurations. A Fanuc LR Mate 200iD is unloading completed single and multi packs and collating them for retail tray loading.

Planning to attend PACK EXPO? Look for our team – you’ll see us there wearing Remtec shirts.